Ukupakishwa kwe-chip okuzenzakalelayo

Dec 12, 2025

Shiya umlayezo

I-chip bonding yisinyathelo esibucayi kakhulu ekukhiqizeni inlay ye-RFID. Uma amapharamitha esiteshini sebhondi ekhukhuleka ngisho kancane, izinga lokuphasa ekuhlolweni kwe-RF lizobonakala ngokushesha.

Lapho i-wafer ifika, ama-chips asese-blue tape. Isisetshenziswa sinephini lokukhipa eliphusha lisuka ngezansi ngenkathi i-vacuum nozzle icosha phezulu, ikhipha ama-chips ngalinye ngalinye. Ububanzi bephinikhodi ye-ejector buncane kune-chip, cishe ingxenyenamba yemilimitha, futhi idinga ukuphusha phakathi nendawo ye-chip. Uma iphusha-phakathi nendawo, i-chip itshekela phezulu futhi umlomo wombhobho awukwazi ukuwubamba. Itheyiphu eluhlaza okwesibhakabhaka ngokwayo inamamaki ahlukene okunamathela. Ukwelashwa kwe-UV okude kusho ukunamathela okubuthakathaka okwenza ukukha kube lula, kodwa ama-chips angashintsha ngesikhathi sokuthutha. Ngaso sonke isikhathi uma sishintshela kunqwaba entsha yetheyiphu eluhlaza okwesibhakabhaka, kufanele sithole uchwepheshe ozoqinisekisa ubude be-ejector nesivinini sokuphuma. Ishesha kakhulu futhi i-chip iyandiza, ihamba kancane futhi ithinta isikhathi somjikelezo.

I-chip isuka ibheke phezulu, ngakho-ke idinga ukuphendulwa ukuze amaqhubu abheke phansi ukuze ahlanganiswe. Imishini yethu isebenzisa indlela ye-flip station. I-nozzle ibeka i-chip esiteshini se-flip, isiteshi sizungeza ama-degree angu-180, bese enye i-nozzle iyithatha ngakolunye uhlangothi. Ezinye izimboni zisebenzisa imibhobho ezishintshayo, esindisa isandla esisodwa, kodwa lokho kudinga umfutho we-vacuum ozinzile. Noma yikuphi ukuguquguquka kwengcindezi kanye ne-chip iyehla. Kukhona enye into ngalesi sinyathelo esiphenyisayo. Ireferensi yokuma kwe-chip kufanele igcinwe. Ngemva kokuphequlula, ukuchezuka kokuthi X, Y, kanye no-θ akukwazi ukuba kukhulu kakhulu, ngaphandle kwalokho ububanzi besinxephezelo sombono ngeke kwanele ngokuhamba kwesikhathi.

I-antenna substrate iyisitoko se-PET roll, imvamisa engama-microns angama-50 noma angama-75, enamaphethini e-antenna asevele efakiwe kuso, izinkulungwane ezimbalwa zamamitha umqulu ngamunye. I-PET iphuma ohlangothini lokukhulula, idlule kuma-tension roller amaningana, bese ima esiteshini se-bonding. Ngemva kokubekwa kwe-chip ngayinye, iwebhu ithuthukisa iphimbo elilodwa, izitobhi, namabhondi futhi. Ukungezwani kuvame ukulawulwa phakathi kwama-Newton ambalwa. Ixega kakhulu futhi iwebhu iyashibilika kubangela amaphutha okuma, iqine kakhulu futhi i-PET iyelula ishintsha ubukhulu bephethini ye-antenna. Sibe nesigameko lapho inzwa ye-tension ohlangothini lokuhlehlisa, lonke uhlobo lwe-antenna lonakala, ukuhlolwa kwehluleke ngokuphelele, futhi ikhasimende lacabanga ukuthi kukhona okungahambi kahle ngama-chips ethu.

Ukukhishwa kwe-Adhesive kwenzeka ngaphambi kokubopha. I-ACA imele i-Anisotropic Conductive Adhesive. Kuyisisekelo se-epoxy resin enezinhlayiya eziguqukayo ngaphakathi. Izinhlayiya ze-conductive ngokuvamile amabhola epulasitiki ahlanganiswe ne-nickel bese kuba yigolide, azungeze ama-microns angu-3 kuya kwangu-5 ububanzi, ahlakazwe ku-adhesive. Ngaphambi kokwelapha, izinhlayiya ziyahlakazeka. Ngesikhathi sokucindezelwa bacindezelwa phansi phakathi kwama-chip bumps nama-antenna pads, okudala ukuguquguquka. Izindawo ezingacindezelwanga zisenezinhlayiya ezihlakazekile futhi azihlali{8}zingasebenzi. Lezi zinto ziyabiza, izinkulungwane ezimbalwa zamayuan ngekhilogremu, futhi imikhiqizo engenisiwe efana ne-Hitachi ne-Sony zibiza kakhulu. Ivolumu yokukhipha kufanele ilawulwe ngokunembile. Sisebenzisa ukukhishwa kwezinaliti, sifaka ingxenye ye-milligram isikhathi ngasinye. Kuncane kakhulu futhi ukumelana nokuxhumana kuyenyuka kunciphisa ububanzi bokufunda, kuningi kakhulu futhi kuyachichima ukuxhuma imikhondo eseduze okubangela izikhindi. Sibe nomqhubi womshini omusha efektri yethu owavula umfutho womoya okhiphayo, inqwaba yaphuma futhi amakhasimende akhononda ngezikhindi yonke indawo, asibiza kakhulu ngesinxephezelo. Amanye amafekthri asebenzisa ukuphrinta kwe-stencil kokunamathisela, ngokushesha kodwa kufanele ushintshe ama-stencil lapho ushintsha imikhiqizo, hhayi ukonga ngamaqoqo amancane anama-SKU amaningi.

Isinyathelo sokucindezela sibaluleke kakhulu. Ikhanda lebhondi lithwala i-chip liye phansi bese liyicindezela kumaphedi othi. Amakhamera aphezulu naphansi asevele athwebule izindawo ze-chip bump kanye nezindawo zephedi ngokuhlukana, isofthiwe yenza ukubonwa kwesithombe ukuze ibale ukuchezuka kuzikhombisi-ndlela ze-XY kanye ne-engeli, bese ingalo yomshini inxephezela. Imishini yethu inokuphinda ukunemba kokumisa eduze nokuhlanganisa noma ukususa ama-microns angama-20 kuye kwangama-30, alungele ama-chips e-HF njengoba usayizi we-chip mkhulu futhi i-bump pitch ibanzi. Ama-chips e-UHF akhohlisayo. Amanye ama-chips ayisikwele esingu-0.4mm kuphela anamaqhubu amabili. Ungaphuthelwa kancane futhi awuhlali nhlobo phezu kwephedi.

Ngemva kokucindezela phansi, ukushisa kuphulukisa ingcina. Imishini yethu inomshini wokushisisa ekhanda lebhondi, futhi inkundla engezansi nayo ingafudumeza. Ngokuvamile sibeka phezulu ukuthi kube ngamadigri angu-170 futhi phansi kube amadigri angu-150 noma angu-160, ngakho ukushisa kugeleza kusuka ezinhlangothini zombili kuya maphakathi ukuze kuphulukiswe nakakhulu. Bamba imizuzwana eyi-10 kuye kwengama-20 kuye ngohlobo lokunamathela. Ukwelashwa kwe-ACA empeleni kuwukusabela okuhlanganayo kwe-epoxy resin. Uma izinga lokushisa noma isikhathi singanele futhi i-crosslinking ingaphelele, izohluleka uma kwenziwa ukuhlola kokuguga komswakamo okungu-85℃85% kamuva. Kodwa uma izinga lokushisa liphezulu kakhulu i-PET substrate ayikwazi ukukuthwala nayo, iyashwabana futhi ikhubazeke. Ingcindezi ibalulekile futhi. Incane kakhulu futhi izinhlayiya ze-conductive azihlikihliki ngokwanele, indawo yokuxhumana ayanele futhi ukumelana kuphezulu. Okuningi kakhulu futhi ukucwenga endaweni yezinhlayiyana kuqhekeka okwenza ukuthintana kube kubi kakhulu, noma ingcina iyaminyana futhi ukusatshalaliswa kwezinhlayiyana kungalingani. Lezi zinhlaka ezintathu zonke zihlobene. Shintsha okukodwa futhi kufanele ulungise ezinye. Izinto ezisetshenziswayo zigcina inqwaba yezindlela zokupheka zamapharamitha ezinhlanganisela ezihlukene ze-chip nezokunamathela, vele uzilayishe lapho ushintsha imikhiqizo.

Ngemuva kokuthi i-chip eyodwa ilashiwe intuthuko yewebhu bese kuthi i-antenna elandelayo ingene ukuze iqhubeke. Imishini esheshayo ingabopha ama-chips amabili noma amathathu ngomzuzwana. Ukungenisa kwe-Mühlbauer kushesha nakakhulu, kodwa okokusebenza kwethu kwakudala efektri kwenza cishe okukodwa ngomzuzwana. Ukuthuthukisa ulayini kubiza izigidi ezimbalwa futhi umphathi ngeke akugunyaze. Uhlangothi olubuyisela emuva luphinde lube nokulawula ukungezwani. Ayikwazi ukukhama ama-chips, kodwa ayikwazi ukukhululeka kakhulu noma umqulu uba nokungcola.

Ukuhlola sikwenza emgqeni. Ngemva nje kokuyihlanganisa idlula kumfundi we-RF. Amayunithi angafundi amakwa nge-inkjet, bese enqatshwa ngesikhathi sokuhlukaniswa. Ukuhlola kufaka phakathi ukuthi i-chip iyaphendula yini, noma ngabe i-EPC ingafundwa futhi ibhalwe ngokujwayelekile, nokuthi ingabe ukuzwela kwanele. Ezinye izimboni zenza ukuhlola ungaxhunyiwe ku-inthanethi, ukuqeda lonke umqulu kuqala bese ziwusebenzisa ngomshini wokuhlola, kudinga abasebenzi abaningi kodwa ukutshalwa kwezimali okokusebenza okuncane. Udinga ukuphumelela ngaphezu kuka-99% ukuze uthole inzuzo. Ngezansi kwalokho awukwazi ngisho ukumboza abasebenzi nezinto zokwakha, ingasaphathwa izikhalazo zamakhasimende kanye nezindleko zokuphinda usebenze.

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